Smart and Sustainable
Special Issue on Cybersecurity for the Smart Manufacturing Ecosystem
Dr. Sudarsan Rachuri
Dr. Jim Davis, Vice Provost, Information Technology & Chief Academic Technology Officer, UCLA, CIO Advisor CESMII
Dr. Soundar Kumara, Professor of Industrial and Manufacturing Engineering, The Pennsylvania State University, University Park, PA, USA
Tom Mahoney, MForesight
Mike Rinker, PNNL
Abstracts are invited for papers to be featured in the ASTM International journal Smart and Sustainable Manufacturing Systems (SSMS) for a special issue on Cybersecurity for the Smart Manufacturing Ecosystem; topics to include but not limited to cyber security infrastructure and strategy for smart manufacturing value chains, supply chains and ecosystems which are characterized by interoperable and interconnected operation and execution systems, automation and smart worker-in-the-loop paradigm.
男和女亲嘴SSMS fosters transdisciplinary research in the intersection of information science, optimization, systems engineering and engineering design, material characteristics, manufacturing, and product life cycle with a focus on how to make manufacturing systems smarter and sustainable. This special issue will address specific research and development on technologies, methods and infrastructure strategies and challenges on cybersecurity protection, detection, response, mitigation and the overall resilience of the individual manufacturers and their collective ecosystems.
The challenge and the opportunity for smart manufacturing (SM) is a crosscutting set of technologies and practices with those technologies that will benefit all industry sectors and types—discrete, batch and continuous manufacturing. SM provides effective and secure human–system infrastructure for better decision making and improving the overall productivity and efficiency of manufacturing across the networked enterprise. There are many relevant efforts, technology and method developments, and particular industry approaches on cybersecurity for manufacturing, but what is lacking is a focused discussion on research challenges, opportunities, the current state of the art of the technology infrastructure for enabling cybersecurity for manufacturing and how to address an anticipated accelerated increase in interconnected data and system. This special issue aims to bring various stakeholders together to address research and technology issues, viewpoint on technology and knowledge gaps, challenges and opportunities, and emerging and disruptive technologies in transitioning cybersecurity for manufacturing for large scale deployment in industry. Since the topic area is cross cutting and broad, we are scoping this to specific topics.
Suggested topics for papers include but are not limited to:
- Cybersecurity for Manufacturing at device level
- Advanced sensors, actuators, and controllers
- PLCs, SCADA
- Firmware, software, micro chips
- Standards and protocols
- Cybersecurity in interconnected factory smart manufacturing operational technologies
- Interconnected operations, automation, smart worker-in-the-loop
- Smart machines; advanced sensing, controls, platforms and modeling process control; cyber physical systems
- Impacts of new technologies, e.g. 5G
- Cybersecurity across the extended manufacturing supply network
- Industrial Internet of Things
- Business data exchange and interoperability
- Safety, security, and resilience
- Standards and protocols
In addition to the above broad categories, this special issue also welcomes research articles including, Industry case studies, benchmarking and testbeds for the cybersecurity technology deployment and infrastructure, innovation ecosystems for advancing cybersecurity for manufacturing, and workforce development and education in Cybersecurity for Manufacturing.
A 250-word preliminary abstract with a title and the names and affiliations of all authors should be submitted to ASTM by November 15, 2020, via email to Alyssa Conaway at firstname.lastname@example.org. The abstract should include a clear definition of the objectives and approach of the work to be discussed, pointing out the novelty of the research and provide summary details of the results obtained. Paper should not be of a commercial nature nor can it have been previously published. However, reviews of previously published technology will also be considered and content should be clearly designated in the abstract. Include a title and the names and affiliations of all authors on the abstract submission.
When uploading the full papers to the submission site, authors can also submit an appropriate video to accompany their paper. The video should be uploaded as a “supplemental file for review” in the file upload section. If you are submitting a video, contact Alyssa Conaway for details at email@example.com.
Upon the receipt of the abstract, based on its suitability to the special issue, ASTM Editorial Office will invite authors to submit papers no later than February 1, 2020. All submissions will be uploaded to the special issue paper submission site (link to be sent via email). All submissions will be peer reviewed according to the normal procedures of this journal. For each accepted manuscript, the corresponding author will receive a copy in portable document format (PDF). All published authors will have the opportunity to purchase reprints of their papers at a nominal cost.